Laminator 7024HPT

The Dynachem (formerly Rohm & Haas, Morton) Vacuum Applicator VA 7024/HPT is a semiautomatic machine, designed and built to ensure complete elimination of air from the surfaces of a printed circuit board, as well as perfect encapsulation of the traces. The machine has been developed for simultaneous application on both sides of the printed circuit panel of dry film, high conformation dry film solder mask ConforMASK™, and conventional dry film solder mask, or dielectric film and copper foil for SBU technology. In order to obtain perfect adhesion of the dry film and ensure total lack of air bubbles, VA 7024/HPT employs heat, vacuum and pressure lamination.

 

 

ADVANTAGES

  • New style - stainless steel construction -suitable for clean room operation

  • Suitable for innerlayer or rigid panels - full range from 0.05–6.40 mm (0.002–0.250 in.) thickness

  • Dynamic and static slap down cycles

  • Greatly reduces solder mask film waste

  • Panel sizes up to 635 x 635 mm (25 x 25 in.)

  • Entire platen area can be filled with one or more panels

  • State-of-the-art vacuum technology

  • New software controlled by PLC-operator interface in local language - touch screen display

  • Platen temperatures are individually controlled - higher heating plate power

  • Convenient operator access

 

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